A new technical paper titled “Monolithic 3D FPGAs Utilizing Back-End-of-Line Configuration Memories” was published by ...

Flurry of regulation and fundings in U.S.; Chinese blacklist expands; materials report; new 3D interconnect process control; ...

A new technical paper titled “Where Do the Electrons Go? Studying Loss Processes in the Electrochemical Charging of ...

Special report on selling inference engines; managing glitch power; 2025 possibilities; AI and mundane tasks; package security; scaling AI; DRAM for AI; why offload fails; shared resources.

This will be an incredible year for innovation, driven by AI and for AI, and pushing the limits of fundamental physics.

The hardware choices for AI inference engines are chips, chiplets, and IP. Multiple considerations must be weighed.