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Electronic Design
11h
Broadcom Bets on 3.5D Packaging Technology to Build Bigger AI Chips
The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.
8h
Nvidia releases microservices to safeguard AI agents
Nvidia NIM is a set of containerized microservices designed to speed up the deployment of generative AI models and today’s ...
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