Nvidia's high-priority Blackwell GPU models use TSMC's more advanced CoWoS-L technology. The discontinued B200A and the single-die B300 GPUs both use CoWoS-S. Due to these changes, certain ...

Huang explained the transition in Nvidia's chip packaging requirements. "As we move into Blackwell, we will use largely CoWoS-L. Of course, we're still manufacturing Hopper, and Hopper will use ...

TL;DR: NVIDIA is shifting from CoWoS-S to CoWoS-L advanced packaging for its Blackwell AI GPUs, requiring increased capacity from TSMC, the leader in semiconductor technology. This transition aims ...

Nvidia's (NASDAQ:NVDA) latest Blackwell lineup suggests it will reduce ... features a dual-die design and is manufactured using CoWoS-L. The 300 series, which includes the GB300 NVL72 and HGX ...

During the inauguration ceremony of SPIL on January 16, Nvidia founder and CEO Jensen Huang stated that the Blackwell system has now fully entered production, which will gradually enhance CoWoS-L ...

Shares of Nvidia Corp. gained on Wednesday after a key partner, Super Micro Computer Inc., said its new AI data center ...

Nvidia’s CEO Jensen Huang has made waves by saying that his company’s most advanced artificial intelligence (AI) chip, Blackwell, will transition from CowoS-S to CoWoS-L advanced packaging technology.

Nvidia's demand for TSM's advanced CoWoS packaging remains strong as it transitions to Blackwell AI chips with new CoWoS-L technology. TSM plans to double CoWoS production by 2025, with Nvidia ...