The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

This article is part of VentureBeat’s special issue, “AI at Scale: From Vision to Viability.” Read more from this special issue here. Enterprises can look forward to new capabilities — and strategic ...

Nvidia NIM is a set of containerized microservices designed to speed up the deployment of generative AI models and today’s ...